Free Application For Admission Pro Hac Vice and Motion For Waiver Fee - Idaho


File Size: 43.0 kB
Pages: 1
Date: June 18, 2009
File Format: PDF
State: Idaho
Category: Court Forms - Federal
Word Count: 200 Words, 1,785 Characters
Page Size: Letter (8 1/2" x 11")
URL

http://www.id.uscourts.gov/docs/PROHACAPPLICATIONWaiver.pdf

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Preview Application For Admission Pro Hac Vice and Motion For Waiver Fee
IN THE UNITED STATES DISTRICT/BANKRUPTCY COURTS FOR THE DISTRICT OF IDAHO ) ) ) ) ) ) ) Case No. APPLICATION FOR ADMISSION PRO HAC VICE AND MOTION FOR WAIVER OF FEE

Pursuant to Local Rule 83.4(e) of the United States District Court for the District of Idaho, _________________________________, hereby applies for admission pro hac vice to appear and participate in this case on behalf of __________________________________. The applicant hereby attests as follows: 1. Applicant resides in ______________________________________, and practices at the following address and phone number________________________________________________ 2. Applicant has been admitted to practice before the following courts on the following dates: Courts: __________________________________Dates: ________________________________ __________________________________Dates:________________________________ __________________________________Dates:________________________________ 3. Applicant is in good standing and eligible to practice in said courts. 4. Applicant is not currently suspended or disbarred in any other courts. 5. Applicant/Designee is on the pro bono panel and requests waiver of the pro hac vice attorney admission fees: [ ] yes [ ] no

6..____________________________________________ , a member in good standing of the bar of this court, of the firm of _______________________________________, practices at the following office address and phone number: _______________and is hereby designated as co-counsel with authority to act as attorney of record for all purposes. Said designee hereby consents to this designation by signing this application.

Dated this day of ___________________________, .

Applicant_____________________________________Designee: ______________________________